In the laboratory, size reduction, surface smoothing, and carbon/gold coating processes suitable for characterization devices are performed on various products and commercial samples.

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Equipment

  • Polishing Device (Lam Plan MM 8027)
  • Polishing Device (Lam Plan MM 500)
  • Lapping Device (Lam Plan MM 835)
  • Hot Bakelite Molding Device (Lam Plan 8008)
  • Metal Strip Cutter (Optimum)
  • Cutting Machine (Lam Plan MM 220)
  • Small Milling Machine (SIEG)
  • Grinding Wheel (Quantum)
  • Handheld Grinding Device (Lam Plan MM 880)
  • Industrial Scale (OHAUS MB 200)
  • Radiation Measurement Device (SAIC)
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