In the laboratory, size reduction, surface smoothing, and carbon/gold coating processes suitable for characterization devices are performed on various products and commercial samples.
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Equipment
- Polishing Device (Lam Plan MM 8027)
- Polishing Device (Lam Plan MM 500)
- Lapping Device (Lam Plan MM 835)
- Hot Bakelite Molding Device (Lam Plan 8008)
- Metal Strip Cutter (Optimum)
- Cutting Machine (Lam Plan MM 220)
- Small Milling Machine (SIEG)
- Grinding Wheel (Quantum)
- Handheld Grinding Device (Lam Plan MM 880)
- Industrial Scale (OHAUS MB 200)
- Radiation Measurement Device (SAIC)